NX
TMG Thermal
for
Advanced Simulation environment solves engineering heat transfer problems
within the most complex NX assemblies.
NX
TMG Thermal
combines the versatility of FE-based modeling with the accuracy of a
finite-difference solver. The high order finite volume simulations offer fast
and high fidelity numerical predictions of radiation, conduction and convection
heat transfer problems. NX TMG Thermal can also be coupled seamlessly to NX
Flow,
the NX CFD solution, for coupled thermo-fluid simulation.
NX
Thermal Couplings
provide a powerful and efficient capability for modeling heat flow between
unconnected parts and components.
Multiple
"what-if" scenarios and positioning of parts within an assembly can be
investigated by defining thermal coupling parameters between unconnected parts
once. Thermal coupling types include conductive, radiative, convective and
interface couplings.
Thermal
couplings can be defined as varying within model parameters, such as temperature
or heat load. All heat paths between unconnected parts are created at runtime
automatically.
NX
Thermal solver capabilities: