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NX
TMG Electronic Systems Cooling
for 
Advanced Simulation environment is an industry-specific vertical application
that leverages the NX
Flow
and NX
Thermal
solvers as well as the PCB.xchange and other high tech and electronics
industry-specific cooling capabilities in a bundle product. It provides a
comprehensive set of tools to simulate 3D air flow and thermo-fluid behaviour in
high tech and electronic systems.
Aplicaciones de NX Electronic Systems
Cooling
 NX
Electronic Systems Cooling
helps resolve thermal engineering challenges early in the design process and is
a valuable aid in understanding the physics of fluid flow and heat transfer for
electronic enclosures and cooling applications.
Some
practical applications
 | Determining
electronic systems cooling strategies
| Enclosure,
subsystem and power supply thermal management
| Detailed
thermal design of PC boards and multi-chip modules
| Thermally
sensitive and critical components placement
| Heat
sinks modeling
| Spacing
requirements between critical parts
| Predicting
fan operating conditions
| Volume
and mass flow estimations
| Computing
pressure inlet/outlet gradients and head losses
| Identifying
recirculation areas and hot spot issues |
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| NX
Electronic Systems Cooling
has an interface with EDA design systems for direct and bi-directional PCB
and FPC data exchanges. All of the leading PCB and FPC layout software
packages are supported:
 | Zuken
| Mentor
Graphics
| Cadence
| VeriBest
| OrCAD
| Incases
| Comtel |
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Main
NX Electronic System Cooling features:
| Specific
capabilities for electronics simulation applications
| Heat
sink models library and heat sink modeler
| Electronic
thermal component library
| Fan
catalogue (database of fan curves) with more than 2000 fans from leading
manufacturers
| PCB
modeler/xchange (ECAD/MCAD bi-directional data exchange) |
| | |
| NX
Electronic Systems Cooling general simulation capabilities
| Steady-state
and transient analysis (adaptive correction multigrid solver)
| Turbulent
(k-εe, mixing length), laminar and mixed flows
| Internal
or external flows
| Automatic
skin mesh (boundary layer mesh) with unlimited layer options
| Complete
set of automatic and/or manual meshing options for the selected fluid
domains
| Unstructured
fluid meshes (supports any combination of tetrahedral, brick, pyramid
and wedge elements-linear and parbolic types)
| Multiple
1st and 2nd order advection with or without flux limiters
| Efficient
time stepping and other algorithms for fast transient calculations
| Solution
intermediate results recovery allowing solver restart
| Heat
loads and temperature restraints on the fluid domain
| Forced,
natural and mixed convection
| Fluid
buoyancy
| Multiple
enclosures
| Multiple
fluids
| Losses
in fluid flow due to screens, filters and other fluid obstructions
(including orthotropic porous blockages)
| Head
loss inlets and openings (fixed or proportional to calculated velocity
or squared velocity)
| Fluid
swirl at inlet and internal fans
| Fluid
recirculation loop with head loss, heat loss, heat input/loss or fluid
temperature change between unconnected fluid regions
| Automatic
connection between disjoint fluid meshes
| Altitude
effects
| Nonlinear
flow boundary conditions
| Nonlinear
thermal contacts
| Thermal
couplings (welded, bolted, bonded, and other thermal contacts) for
assembly modeling
| Disjoint
thermal/fluid meshes support in assembly modeling
| Surface-to-surface
radiative heat transfer
| Thermal
solution customization (user subroutine)
| Hemicube-based
view factor calculation (using graphics card hardware)
| Radiation
enclosures
| Radiative
sources
| Diurnal
solar environmental heating (including cloud, altitude, longitude and
latitude effects, pollution and other solar attenuation effects)
| Specular
and transmissive surfaces
| Hydraulic
fluid networks
| Joule
heating
| Heater
and thermostat modeling
| Peltier
cooler modeling |
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