Moldex3D/Solid is the world's leading true 3D simulation solution for in-depth design verification and troubleshooting With the best-in-class 3D technology based on solid hybrid mesh and High-Performance Finite Volume Method (HPFVM), Moldex3D/Solid allows you to optimize product designs and predict manufacturability.
By using Moldex3D/Solid, users can perform true 3D simulation on the widest range of application, including thick parts, those that have extreme thickness changes from thin to thick, those that are difficult to define a proper midplane model, or those with very complicated part geometry. Users can directly analyze the solid model without having to make significant model simplifications. The explicit analysis capabilities of Moldex3D/Solid provide users deep insight in solid plastic flow behaviors from macro view to micro view, such as fountain flow, inertia effect, gravity effect or shear-induced viscous heating. The intuitive displays help users to evaluate analysis results in three dimension and clearly address design defects.
Moldex3D/Solid has been proven by many users to be the most accurate 3D simulation solution. It is capable of simulating the plastics filling and packing, mold cooling, fiber orientation and part warpage for thermoplastic injection molding. Additional modules simulate multi-component molding (MCM) and reactive injection molding (RIM). Besides, the interface modules (I2) link Moldex3D with the popular structural analysis software to allow you to evaluate the interaction of process-induced material anisotropy and its effects on part structure.
Furthermore, Moldex3D/Solid has been developed with parallel computing technology in mind. With high-performance parallelized computing kernel, users can perform analyses on complex models with much less time than ever.
Moldex3D/Shell, which is based on an efficient and robust 2.5D technology, helps you to in-depth analyze and optimize the design of conventional parts. With the unique Fast Finite Element Method (FFEM) and meshing technologies, users can significantly decrease the mid-plane model preparation time and validate more design iterations.
Moldex3D/Shell is capable of simulating the plastics filling and packing, mold cooling, fiber orientation and part warpage for thermoplastic injection molding. Additional modules simulate gas-assisted injection molding (GAIM), multi-component molding (MCM) and reactive injection molding (RIM). Besides, the interface modules link mold-filling and structural analyses to allow you to evaluate the interaction of part structure and manufacturability.
After more than 15-year development, Moldex3D/Shell has become the most robust and reliable analysis tool. With the power of Moldex3D/Shell, users can quickly predict and solve injection molding manufacturing problems, and further optimize designs. More Shell information
Solid-Flow
Moldex3D/Solid-Flow
Moldex3D-Flow simulates the entire filling process of injection molding for thermoplastic materials. With the power of Moldex3D-Flow, you can clearly understand how the solid melt flow progresses, accurately identify where solid weld surfaces are, detect short shot problems, predict air trap location, etc.
The explicit analysis capabilities of Moldex3D/Solid-Flow give you deep insight in solid plastic flow behaviors from macro view to micro view, such as fountain flow, inertia effect and gravity effect. With the power of Moldex3D/Solid-Flow, you can clearly understand how the solid melt flow progresses, accurately identify where solid weld surfaces are, detect short shot problems, etc.
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Solid-Pack
Moldex3D/Solid-Pack
Moldex3D-Pack incorporates material compressibility (PVT change) in its full 3D Navier-Stokes solver to account for the density variation and melt flow behaviors in packing process for thermoplastic materials. Using Moldex3D-Pack, it can help you to preciously determine gate freeze time, efficient packing time and proper packing pressure to minimize areas of high volumetric shrinkage.
Using Moldex3D/Solid-Pack, even for thick parts or parts with big thickness changes, you can also investigate all factors in packing process from material choice, gate design, and processing conditions. With true 3D technology, it can help you to preciously determine gate freeze time, efficient packing time and proper packing pressure to minimize areas of high volumetric shrinkage.
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Solid-Cool
Moldex3D/Solid-Cool
Moldex3D-Cool is a true 3D simulation tool to analyze the mold cooling process. Based on true 3D technology, it is an efficient tool to accurately analyze the mold temperature, the efficiency of cooling channel layout, and the required cooling time. Furthermore, advanced transient cool function supports the simulation of variotherm process to simulate the results of deliberately using higher mold temperature during filling and packing and then dropping the temperature for the remainder of cycle.
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Solid-Warp
Moldex3D/Solid-Warp
Moldex3D-Warp provides users a true 3D simulation tool to anatomize the causes of shrinkage and warpage and further control these defects before mold is built. With Solid-Warp, users can easily and efficiently improve the part quality and optimize design. For fiber-filled material, Solid-Warp incorporates fiber composite theories and the fiber orientation results from Solid-Fiber to predict its anisotropic shrinkage and warpage.
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Solid-Fiber
Moldex3D/Solid-Fiber
Moldex3D-Fiber accurately simulates the 3D fiber orientation in mold-filling process and further calculates the process-induced anisotropic thermo-mechanical properties of fiber-reinforced plastic part. With Moldex3D-Fiber, users can understand the 3D orientation of fiber and further control the anisotropic shrinkage of fiber-reinforced part. The process-induced anisotropic shrinkage and mechanical properties due to fiber orientation are therefore taken into account for accurate warpage prediction.
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Solid-MCM
Moldex3D/Solid-MCM
Multi-component molding is one of the greatest methods to diversify the development of the plastic molded product fabrication. Moldex3D-MCM simulates the multiple components molding process, including insert molding, overmolding and multi-shot sequential molding. Based on true 3D technology, explicit analysis capabilities of Moldex3D-MCM give you a powerful tool to accurately analyze the interaction behavior of different components and further optimize product design. Moreover, this module helps you to predict the warpage due to property mismatch of different materials, prolonged cooling time and unsymmetrical shrinkage in two-color or overmolding processes...etc.
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Solid-RIM
Moldex3D/Solid-RIM
Moldex3D-RIM module is a true 3D simulation tool to analyze the reactive injection molding process for thermoset materials. The typical applications include injection molding of unsaturated polyester, polyurethane, liquid silicon rubber, epoxy molding compound, etc. It is capable of simulating cavity filling and curing, part warpage, fiber orientation, multi-component process, etc.
Moldex3D/Solid-RIM helps users to investigate potential defects in part and runner designs to optimize cavity filling and curing. With best-in-class 3D technology, Moldex3D/Solid-RIM provides more accurate analysis results than ever. Moreover, Moldex3D/Solid-RIM links seamlessly with InPack, a pre- and post-processor dedicated for Microchip encapsulation, to calculate the paddle shift and wire sweep for Microchip encapsulation.
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Solid-I2
Moldex3D/Solid-I2
Moldex3D-I2 is a series of interface modules to integrate Moldex3D and famous commerical structural CAE software, including ABAQUS, ANSYS, MSC.Nastran, NENastran, LS-Dyna, Marc and DigiMat. These modules help users to introduce the process-induced properties, such as fiber orientation or residual stress, into the above-mentioned software to allow users to evaluate the impact of the molding process on the structural performance of the part.
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Parallel Computing
Parallel computing
Parallel computing is fast becoming an inexpensive alternative to standard supercomputer for solving large scale problems that arise in scientific and engineering applications. Generally, there are two types of parallel computing platform: (1)Symmetric Multiple Processor, SMP, and (2) Massively Parallel Processing, MPP. The CPUs of a SMP platform share the same memory and are controlled by a single operating system.
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Solid-Optics
Moldex3D-Optics
Based on three-dimensional filling analysis and viscoelastic analysis, Moldex3D-OPTICS can precisely predict the birefringence caused by complicated process-induced anisotropy in the space. Moreover, this module not only predicts birefringence in each molding stage but also integrates the photo-elasticity to provide the retardation, fringed order and fringed pattern after a light passing through the part.
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Solid-Viscoelasticity
Moldex3D-Viscoelasticity
Plastic (Polymeric) fluids are often called viscoelastic fluids because they have both viscous and elastic properties. Moldex3D
-Viscoelasticity includes this essential characteristic to effectively predict the flow-induced residual stress and prevent the potential design problem. Furthermore, this stress can also be applied to predict the optical properties and be taken into account in the warpage analysis.
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Solid-IC Package
Moldex3D/Solid-IC Package
Moldex3D-IC Package provides a complete true 3D solution for IC package process, including filling and curing analysis, warpage prediction, wire sweep simulation, etc. Highly accurate analysis results enable users to analyze and further optimize the IC encapsulation design and process.
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Solid-ICM
Moldex3D/Solid-ICM
Moldex3D/Solid-ICM(Injection Compression Molding) provides a complete simulation capability for injection compression molding to verify process conditions such as delay time or compression gap and to analyze potential issues in advance for thin and flat products such as light guide plates.
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Solid-FAIM
Moldex3D/Solid-FAIM
Solid-FAIM (Fluid-Assisted Injection Molding) provides a simulation tool to analyze the dynamics of fluid-assisted injection molding process. It is capable of simulating fluid flows, such as gas or water, injected into the cavity through the melt entrance or any specific fluid entrances. This simulation tool enables users to visualize 3D fluid penetration behavior inside the mold cavity and to optimize the mold design and process settings.
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Solid-Stress
Moldex3D/Solid-Stress
Moldex3D/Solid-Stress provides an easy-to-use simulation tool for stress analysis of plastic parts. It integrates with Moldex3D-Fiber to fully include the fiber orientation effects seamlessly. Users can have user-defined boundary condition settings, such as stress or force, structural performance to observe the product deformation and stress distribution and avoid potential quality problems.
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