Moldex3D/eDesign-RIM 

Moldex3D-RIM module is a true 3D simulation tool to analyze the reactive injection molding process for 
thermoset materials. The typical applications include injection molding of unsaturated polyester, polyurethane, 
liquid silicon rubber, epoxy molding compound, etc. It is capable of simulating cavity filling and curing, 
part warpage, fiber orientation, multi-component process, etc. 


Moldex3D/eDesign-RIM helps users to investigate potential defects in part and runner designs to optimize cavity filling and curing. With best-in-class 3D technology, Moldex3D/eDesign-RIM provides more accurate analysis results than ever. Moreover, Moldex3D/eDesign-RIM links seamlessly with InPack, a pre- and post-processor dedicated for Microchip encapsulation, to calculate the paddle shift and wire sweep for Microchip encapsulation. 

Capabilities
Moldex3D/eDesign-RIM allows you to 

Predict the melt front advancement to see how the mold fills 
Predict 3D fountain flow phenomena 
Predict 3D inertia phenomena 
Predict 3D viscosity heating effects 
Predict the injection pressure and evaluate the requirement of clamping force 
Predict the conversion variation in molding process 
Predict weld line locations to minimize or eliminate them 
Predict air traps 
Identify short shot problems 
Optimize gate design to minimize weld lines and achieve balanced filling 
Optimize process conditions in filling stage, such as injection time, melt temperature, ram speed profile, curing time, etc 
Simulate filling process for multi-cavity molds or family molds 
Features 

Mold filling analysis 
- Melt front time prediction 
- Pressure 
- Temperature 
- Shear stress 
- Shear rate 
- Velocities in X, Y, Z 
- Conversion 
- Density 
- Scorch Index 【New in R9.1】 
- Total velocity 
- Velocity vector field 
- Sprue pressure variation during filling process 
- Clamping force of mold in X, Y, Z directions 
- Flow rate variation during filling process 

Curing analysis 
- Pressure 
- Temperature 
- Mass flow rate 
- Shear stress 
- Shear rate 
- Conversion 
- Density 
- Velocity vector 

Clamping force prediction 
Gate design evaluation 
- Gate location 
- Gate type 
- Gate size 

Weld-lines prediction 
Air trap location prediction 
Runner design evaluation 
- Runner layout 
- Runner size 
- Runner type 

Warpage problem prediction 
- Evaluate final part shape before actual molding 
- Evaluate fiber orientation effect on warpage 
- Separate total displacement into x-axis, y-axis, and z-axis displacements to show the deformation in each direction 

Fiber orientation evaluation 
- Predict 3D fiber orientation and thermo-mechanical property distributions 
- Model the fiber length, diameter and concentration in evaluating fiber orientation, shrinkage and warpage 

Simulate Microchip encapsulation process 
Link to InPack to simulate wire sweep for Microchip encapsulation 
Link to InPack to simulate paddle shift for Microchip encapsulation