Moldex3D/eDesign-Cool 

Moldex3D-Cool is a true 3D simulation tool to analyze the mold cooling process. Based on true 3D technology, it is an efficient tool to accurately analyze the mold temperature, the efficiency of cooling channel layout, and the required cooling time. Furthermore, advanced transient cool function supports the simulation of variotherm process to simulate the results of deliberately using higher mold temperature during filling and packing and then dropping the temperature for the remainder of cycle. 



Based on true 3D technology, eDesign-Cool is an efficient tool to accurately analyze the mold temperature, the efficiency of cooling channel layout and the required cooling time in the design phase. 

Moldex3D/eDesign-Cool is a useful troubleshooting tool to detect possible mold cooling system defects, such as unbalanced cooling, hot spots, prolonged cooling time due to poor cooling efficiency. With true 3D technology, users can accurately evaluate the eDesign cooling efficiency to further optimize the cooling system design and reduce cycle time. 

Capabilities
Moldex3D/eDesign-Cool allows you to 

Predict temperature within part, runner, cooling channels, inserts, etc 
Evaluate the efficiency of cooling system design, including cooling circuits, inserts, mold base, heating rod, etc 
Minimize unbalanced cooling problem 
Determine the required cooling cycle time 
Optimize mold cooling system design to achieve optimum cooling efficiency with the minimum cycle time 
Use an easy and fast cooling analysis solution "Mesh-Free eDesign-FastCool" to quickly validate mold cooling system designs. 
Simulate multi-component molding process, including insert molding and multi-shot sequential molding(Moldex3D/eDesign-MCM module is required)

Features 

Part cooling analysis 
- Calculate 3D temperature distribution within part, runner and part insert.
- Calculate frozen areas 
- Calculate heat transfer rate and heat load 
- Calculate required cooling time 


Moldbase cooling analysis 
- Calculate solid temperature distribution within mold base, insert and cooling circuit 
- Calculate the cooling circuit efficiency 
- Calculate part insert effects (Moldex3D/eDesign-MCM module is required) 
- Calculate mold insert of different materials, such as beryllium copper. 
- Calculate heating rod effects 


Cooling channel network analysis 
- Calculate coolant temperature along each cooling channel 
- Calculate the pressure drop of each cooling channel 
- Analyze the Reynolds number along each cooling channel 


Auto-set cooling time analysis 
- Provide easy-to-use and improved estimation for the required cooling time 


Coupled Flow-Pack-Cool analysis 
- Incorporate the heat flux results from Flow/Pack analysis for cooling calculation. 
- Improve accuracy of Flow, Pack, Cool and Warp analyses. 


Transient Cooling analysis 
- Support variotherm process simulation.
- Support RHCM process simulation.
- Predict temperature variation history in mold cooling stage.